Notes about MVD
in our PISA simulations
John Sullivan
comments to: sullivan@lanl.gov

These notes summarize the changes needed in the input parameters to PISA in order to make the mass of the MVD in the simulations agree with the mass of the MVD in the real design. In the notes below the "old" model refers to the PISA model used up until now, including in the 10K run. The "new" model refers to the model I propose to start using now -- which is much closer to the MVD design shown in the MVD design book.

part name
in PISA
part name
in design book
mass in
old model (gm)
mass in
new model (gm)
notes
Motherboard Motherboard,
LDOs,
connectors,
cooling ...
1148 2692 radius increased,
more detailed
components
enclosure
endcaps
endplate
assembly
1898 2676 radius increased
electronics
(MCMs in barrel)
MCMs
in barrel
402 1300 they got thicker and
wider and the material
was G10 not alumina
bus cable power/comm
cable
166 1265 changed from a
kapton cable to
a circuit board
enclosure inner/outer
cover
773 846 radius increased
struts struts 269 338 OD increased from
1 to 1.25 inch
dummy MCMs dummy MCMs 0 271 previously not
in simulations
Si in barrel Si in barrel? 245 245 no changes
(cooling) plenum plenum 206 218 MCMs got bigger
Mounting
plate
endplate
adapter
64 72 about the same
rohacell frame cage 82 63 ribs thinner
Si in pads Si in pads? 52 52 no changes
total MVD total MVD 5305 gm 10036 gm design book
says 10975 gm

On April 30, 1998 a the mass of the "bus cable" a.k.a. "power/comm cable" was changed from 2433 gm total to 1265 gm total. This reflects a modification in the cable design which was made to reduce the mass. The parameter VER_TH_BUS_CABLE in phnx.par had to be changed from 0.25 to 0.13 to account for this design improvement. This change is reflected in the table below.

The only material I know I have omitted from the PISA code is the kapton cables from the Si to the MCM's (which I left out because PISA crashes when I put it in and I can't figure out why). These cables should have a total mass somewhere around 1/3 or so of the mass of the Si in the barrel (therefore around 245/3 = 82 gm).

I propose changing the following parameters, which are input to PISA (via the phnx.par file) to set up the new pisa code shown above:

parameter name old value new value notes
R2_VER_ENC 23.165 cm 28.35 cm inner radius of MVD
outer (rohacell) cover
DZ_VER_ENDPL 0.109 cm 0.10 cm half-thickness (dz/2) of
enclosure endcap
(aka enclosure endcap)
DZ_VER_MOPL 0.048 cm 0.054 cm half-thickness (dz/2) of
mounting plate
(aka endplate adapter)
DVOEL(1) 2.00 cm 2.15 cm dx/2 of MCM
DVOEL(2) 0.055 cm 0.076 cm dy/2 of MCM
DZ_VER_PMB 0.16 cm 0.21 cm half-thickness, motherboard
R_VER_PMB 19.0 cm 25.0 cm outer radius, motherboard
VER_EL_SPACE 0.8 cm 0.85 cm spacing between MCMs in plenum
VER_TH_BUS_CABLE 0.043 cm 0.13 cm full thickness of
power/comm cable
VER_W_BUS_CABLE 3.0 cm 7.5 cm full width of
power/comm cable
WDVROH 0.6 cm 0.54 cm width of ribs in
rohacell cages
MED_VER_BUS_CABLE 108
= kapton
107
= G10
material for
power/comm cable
MED_VER_MCM 107
= G10
103
= alumina
material for MCM
MED_VER_DUMMY -- 106
= aluminum
new definition of
material for dummy MCM

In addition to these input parameter changes, I will have to make a few changes in the PISA code because the current code assumed the partially populated sectors of the MVD do not have power/communications cables going to them. However, the current "official" design assumes that all 24 power/comm cables are the same. Removing the unneeded sections would remove roughly 2/3 of the mass from 8 of the 24 power/comm cables, reducing the mass by around 281 gm (probably a little less than this). Adding the dummy aluminum (or other material) plates in the cooling plenum also requires some code changes. The files I need to change in pisa are summarized below:

file name description of change
pisa/src/ver/ver_pars.f Add new parameter MED_VER_DUMMY_MCM (tracking
medium) for "dummy MCMs", add default value
for MED_VER_MCM, change default values for
changed parameters (i.e. the parameters in the table above)
pisa/src/ver/ver_plen.f added "dummy MCMs", all "bus cables" aka
"power/communications cables" are now the same
size, previously there was a smaller type
corresponding to sections of the detector with
incomplete Si coverage
pisa/bin/phnx.par changed values of the parameters in the table above,
added new parameter MED_VER_DUMMY_MCM
pisa/inc/fpvlink.inc add new parameter OFVA_MED_DUMMY, used as a
pointer in, the MVD geometry parameters bank
pisa/inc/gugeom.inc increase radial boundary of MVD from 25 to 30 cm

Here is a little history the total MVD mass in PISA:

date total MVD mass
in PISA (gm)
notes
23-Aug-94 7855 endplates were made thinner
after this,
outer radius 20 cm
16-Apr-97 5324 outer radius 25cm
4-Feb-98 11207 outer radius 30 cm
30-Apr-98 10954 Power/Comm cable mass reduced


updated 30-Apr-1998